USPTO Assignments on the Web

	United States Patent and Trademark Office
	Home\|Site Index\|Search\|Guides\|Contacts\|eBusiness\|eBiz alerts\|News\|Help

Assignments on the Web > Patent Query

Patent Assignment Abstract of Title

NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Total Assignments: 1

Patent #:	NONE	Issue Dt:		Application #:	18386687	Filing Dt:	11/03/2023
Publication #:	20240153906	Pub Dt:	05/09/2024
Inventors:	Byeongtak PARK, Gwanghee JO, Siwoong WOO, Jiwon SON, Yongjoo LEE, Hoechul KIM, Inhwa BAEK et al
Title:	SUBSTRATE BONDING APPARATUS

Assignment: 1

Reel/Frame:

065446/0001

Recorded: 11/03/2023

Pages: 17

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

PARK, BYEONGTAK

Exec Dt:

05/08/2023

JO, GWANGHEE

Exec Dt:

11/02/2023

WOO, SIWOONG

Exec Dt:

05/08/2023

SON, JIWON

Exec Dt:

05/08/2023

LEE, YONGJOO

Exec Dt:

05/08/2023

KIM, HOECHUL

Exec Dt:

05/19/2023

BAEK, INHWA

Exec Dt:

05/22/2023

SEOK, SEUNGDAE

Exec Dt:

05/08/2023

JANG, SEHOON

Exec Dt:

05/15/2023

PHEE, JAEHYUN

Exec Dt:

05/30/2023

Assignee:

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG-RO, YEONGTONG-GU

SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677

Correspondent:

EUGENE M LEE

LEE IP LAW, P.C.

3141 FAIRVIEW PARK DRIVE, SUITE 500

FALLS CHURCH, VA 22042

Search Results as of: 06/20/2024 05:03 PM

If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6

Web interface last modified: August 25, 2017 v.2.6