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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
18501237
Filing Dt:
11/03/2023
Publication #:
Pub Dt:
05/09/2024
Inventor:
Yoshihiko Narisawa
Title:
Flexible Printed Wiring Board and Method for Manufacturing Same
Assignment: 1
Reel/Frame:
065466/0611Recorded: 11/06/2023Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/20/2023
Assignee:
12-15, SHIBA-DAIMON 1-CHOME, MINATO-KU
TOKYO-TO, JAPAN 105-0012
Correspondent:
MARSHALL, GERSTEIN & BORUN LLP
233 SOUTH WACKER DRIVE
SUITE 6300
CHICAGO, IL 60606-6357
Assignment: 2
Reel/Frame:
069565/0869Recorded: 12/12/2024Pages: 15
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/01/2024
Assignee:
12-15, SHIBA-DAIMON 1-CHOME, MINATO-KU
TOKYO, JAPAN 105-0012
Correspondent:
MARSHALL GERSTEIN & BORUN
233 S. WACKER DRIVE
6300 WILLIS TOWER
CHICAGO, IL 60606-6357

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