Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18280918
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Filing Dt:
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09/07/2023
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Publication #:
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Pub Dt:
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05/16/2024
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Inventor:
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Guanmeng XU
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Title:
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METHOD FOR PREPARING DIELECTRIC LAYER ON SURFACE OF WAFER, WAFER STRUCTURE, AND METHOD FOR SHAPING BUMP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.166 FENGLI ST, SUZHOU INDUSTRIAL PARK |
| SUZHOU, JIANGSU, CHINA 215024 |
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| INTEGRATED FREE TRADE ZONE, HEFEI NEW & HI TECH INDUSTRIAL DEVELOPMENT ZONE |
| HEIFEI, ANHUI, CHINA 230000 |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP. |
| 8110 GATEHOUSE ROAD, SUITE 100E |
| FALLS CHURCH, VA 22042 |
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