Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18084286
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Filing Dt:
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12/19/2022
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Publication #:
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Pub Dt:
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05/16/2024
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Inventors:
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Chia-Ming CHANG, Cheng-Lung CHEN
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Title:
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ELECTRONIC ASSEMBLY, METHOD FOR MANUFACTURING ELECTRONIC ASSEMBLY AND COMPOSITE THERMALLY CONDUCTIVE SHEET
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.69, LIDE ST., ZHONGHE DIST. |
| NEW TAIPEI CITY, TAIWAN |
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| LONGMA INFORMATION TECHNOLOGY INDUSTRIAL PARK |
| TANGTOU VILLAGE, SHIYAN TOWN, BAOAN DISTRICT |
| SHENZHEN CITY, GUANGDONG PROVINCE, CHINA |
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| R. BURNS ISRAELSEN |
| MASCHOFF BRENNAN |
| 1389 CENTER DR STE. 300 |
| PARK CITY, UT 84098 |
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