Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18125684
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Filing Dt:
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03/23/2023
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Publication #:
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Pub Dt:
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05/23/2024
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Inventor:
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ZHI-CHENG LAN
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Title:
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PACKAGING STRUCTURE, PACKAGING SUBSTRATE, AND MANUFACTURING METHOD OF THE PACKAGING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, PENGDING ROAD, HUAI AN CITY,JIANGSU PROVINCE, CHINA |
| HUAI AN, CHINA |
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| 27TH FLOOR,BLOCK A,AVARY TIME CENTER,NO.2038 HAIXIU ROAD,HAIBIN COMMUNITY,XIN AN STREET |
| SHENZHEN, CHINA |
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| 8F., NO. 8, BAOQIANG RD., XINDIAN DIST.,,NEW TAIPEI CITY 231,TAIWAN (R.O.C.) |
| NEW TAIPEI, TAIWAN |
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| TUNG-YUN MCNALLY |
| 550 S. HOPE STREET, SUITE 2825 |
| LOS ANGELES, CA 90071 |
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