Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18056564
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Filing Dt:
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11/17/2022
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Publication #:
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Pub Dt:
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05/23/2024
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Inventor:
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Yuan WEI
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Title:
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DOUBLE-SIDED LAMINATE PACKAGE WITH 3D INTERCONNECTION STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9369 CARROLL PARK DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| STEINFL + BRUNO LLP |
| 155 N. LAKE AVE. SUITE 700 |
| PASADENA, CA 91101 |
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06/20/2024 03:08 AM
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