Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18426243
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Filing Dt:
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01/29/2024
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Publication #:
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Pub Dt:
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05/23/2024
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Inventors:
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Gulbagh Singh, Kuan-Liang Liu, Wang Po-Jen, Kun-Tsang Chuang, Hsin-Chi Chen
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Title:
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SEMICONDUCTOR WAFER WITH DEVICES HAVING DIFFERENT TOP LAYER THICKNESSES
LAYER THICKNESSES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-77 |
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| FOLEY & LARDNER LLP |
| 500 WOODWARD AVENUE |
| SUITE 2700 |
| DETROIT, MI 48226 |
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