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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18279883
Filing Dt:
09/01/2023
Publication #:
Pub Dt:
05/30/2024
Inventors:
Kazuyoshi YAMAMOTO, Mao TAKEDA, Takahumi MIZUGUCHI, Eri YOSHIZAWA
Title:
RESIN COMPOSITION, RESIN SHEET, MULTILAYERED PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
064788/0148Recorded: 09/05/2023Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/20/2023
Exec Dt:
07/24/2023
Exec Dt:
07/21/2023
Exec Dt:
07/21/2023
Assignee:
1-1, MARUNOUCHI 2-CHOME, CHIYODA-KU,
TOKYO, JAPAN 100-0005
Correspondent:
JCIPRNET
8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
TAIPEI, 100404 TAIWAN

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