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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18216783
Filing Dt:
06/30/2023
Publication #:
Pub Dt:
05/30/2024
Inventors:
In Soo Han, Eun Ju Noh, Seul Yi, Kyeong Hoon Jang, Ju Seong Park, Jin Bo Chae et al
Title:
POLYPROPYLENE COMPOSITE RESIN COMPOSITION AND A MOLDED ARTICLE CONTAINING THE SAME
Assignment: 1
Reel/Frame:
064137/0093Recorded: 07/03/2023Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/01/2023
Exec Dt:
05/31/2023
Exec Dt:
06/01/2023
Exec Dt:
05/30/2023
Exec Dt:
06/01/2023
Exec Dt:
06/01/2023
Exec Dt:
06/01/2023
Assignees:
12, HEOLLEUNG-RO, SEOCHO-GU
SEOUL, KOREA, REPUBLIC OF 06797
12, HEOLLEUNG-RO, SEOCHO-GU
SEOUL, KOREA, REPUBLIC OF 06797
1221-32, DAEHOMAN-RO, SEONGMUN-MYEON, CHUNGCHEONGNAM-DO
DANGJIN-SI, KOREA, REPUBLIC OF 31703
Correspondent:
LEMPIA SUMMERFIELD KATZ LLC
20 SOUTH CLARK STREET
SUITE 600
CHICAGO, IL 60603

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