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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18377379
Filing Dt:
10/06/2023
Publication #:
Pub Dt:
05/30/2024
Inventors:
Xianming CHEN, Gao HUANG, Wenjian LIN, Juchen HUANG, Benxia HUANG
Title:
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREFOR
Assignment: 1
Reel/Frame:
065145/0100Recorded: 10/06/2023Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/27/2023
Exec Dt:
09/27/2023
Exec Dt:
09/27/2023
Exec Dt:
09/27/2023
Exec Dt:
09/27/2023
Assignee:
FPC FACTORY, 3209 NORTH ZHUFENG AVENUE, DOUMEN, ZHUHAI,
GUANGDONG, CHINA 519175
Correspondent:
JONG H PARK
13800 COPPERMINE ROAD
FL 1-3
HERNDON, VA 20171

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