Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18379106
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Filing Dt:
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10/11/2023
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Publication #:
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Pub Dt:
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06/06/2024
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Inventors:
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Zhiyu Huang, BOCHENG CAO, SIYU ZHU, HANG YU, YUNG-CHEN LIN, CHI-I LANG
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Title:
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EUV PHOTORESIST AND UNDERLAYER ADHESION MODULATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3050 BOWERS AVENUE |
SANTA CLARA, CALIFORNIA 95054 |
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JUSTIN K. BRASK |
1211 SW FIFTH AVENUE |
SUITE 1900 |
PORTLAND, OR 97204 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3050 BOWERS AVENUE |
SANTA CLARA, CALIFORNIA 95054 |
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JUSTIN K. BRASK |
1211 SW FIFTH AVENUE |
SUITE 1900 |
PORTLAND, OR 97204 |
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06/26/2024 04:42 PM
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