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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
18379106
Filing Dt:
10/11/2023
Publication #:
Pub Dt:
06/06/2024
Inventors:
Zhiyu Huang, BOCHENG CAO, SIYU ZHU, HANG YU, YUNG-CHEN LIN, CHI-I LANG
Title:
EUV PHOTORESIST AND UNDERLAYER ADHESION MODULATION
Assignment: 1
Reel/Frame:
065392/0826Recorded: 10/30/2023Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/30/2022
Exec Dt:
01/03/2023
Exec Dt:
01/03/2023
Exec Dt:
01/05/2023
Exec Dt:
01/01/2023
Exec Dt:
12/31/2022
Assignee:
3050 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95054
Correspondent:
JUSTIN K. BRASK
1211 SW FIFTH AVENUE
SUITE 1900
PORTLAND, OR 97204
Assignment: 2
Reel/Frame:
065468/0771Recorded: 11/06/2023Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/31/2023
Exec Dt:
10/31/2023
Exec Dt:
11/06/2023
Exec Dt:
11/04/2023
Exec Dt:
10/31/2023
Exec Dt:
10/31/2023
Assignee:
3050 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95054
Correspondent:
JUSTIN K. BRASK
1211 SW FIFTH AVENUE
SUITE 1900
PORTLAND, OR 97204

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