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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18553424
Filing Dt:
09/29/2023
Publication #:
Pub Dt:
06/13/2024
Inventors:
Wenliang DAI, Liguo JIANG, Feng LING, Jian ZHANG
Title:
Multilevel distributed parallel computing method for integrated circuit board simulation
Assignment: 1
Reel/Frame:
066208/0486Recorded: 01/06/2024Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/20/2023
Exec Dt:
09/20/2023
Exec Dt:
09/20/2023
Exec Dt:
09/20/2023
Assignee:
ROOM 01, 4TH FLOOR, NO. 5, LANE 60, NAXIAN ROAD, PUDONG NEW AREA
SHANGHAI, CHINA 201210
Correspondent:
MUNCY, GEISSLER, OLDS & LOWE, PC
125 S. ROYAL ST.
ALEXANDRIA, VA 22314

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