Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18545306
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Filing Dt:
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12/19/2023
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Publication #:
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Pub Dt:
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06/20/2024
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Inventors:
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Hiroki OTA, Ryoya TERAKAWA
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Title:
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POLISHING HEAD, POLISHING DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2-1 SHIBAURA, MINATO-KU |
| TOKYO, JAPAN 105-8634 |
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| GREENBLUM & BERNSTEIN, P.L.C. |
| 1950 ROLAND CLARKE PLACE |
| RESTON, VA 20191 |
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