Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18085660
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Filing Dt:
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12/21/2022
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Publication #:
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Pub Dt:
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06/27/2024
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Inventors:
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An-Sheng CHENG, Stephen COATES
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Title:
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EMBEDDED DIE PACKAGING OF POWER SEMICONDUCTOR DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1220 N. MARKET ST. #806 |
| WILMINGTON, DELAWARE 19801 |
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| MILTONS IP/P.I. |
| 15 FITZGERALD RD. SUITE 200 |
| OTTAWA, K2H 9G1 CANADA |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SUITE 201, 770 PALLADIUM DRIVE |
| KANATA, CANADA K2V 1C8 |
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| MILTONS IP/P.I. |
| 15 FITZGERALD RD. SUITE 200 |
| OTTAWA, K2H 9G1 CANADA |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SUITE 201, 770 PALLADIUM DRIVE |
| OTTAWA, CANADA K2V 1C8 |
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| MILTONS IP/P.I. |
| 15 FITZGERALD RD. SUITE 200 |
| OTTAWA, K2H 9G1 CANADA |
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