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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18415798
Filing Dt:
01/18/2024
Publication #:
20240242981
Pub Dt:
07/18/2024
Inventors:
Sehoon JANG, Inhwa BAEK, Hyungku KIM, Kibum YU, Jaesung YUN, Yongin LEE, Jaehyuk JUNG et al
Title:
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
Assignment: 1
Reel/Frame:
066303/0596Recorded: 01/31/2024Pages: 13
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
JANG, SEHOON
Exec Dt:
08/03/2023
BAEK, INHWA
Exec Dt:
07/26/2023
KIM, HYUNGKU
Exec Dt:
07/31/2023
YU, KIBUM
Exec Dt:
07/23/2023
YUN, JAESUNG
Exec Dt:
07/24/2023
LEE, YONGIN
Exec Dt:
07/24/2023
JUNG, JAEHYUK
Exec Dt:
07/31/2023
JO, GWANGHEE
Exec Dt:
10/23/2023
CHO, YOUNGJIN
Exec Dt:
08/10/2023
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON, VA 20195

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