Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/25/2025
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Application #:
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17913819
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Filing Dt:
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03/29/2023
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Publication #:
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Pub Dt:
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07/18/2024
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Inventors:
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Akira BANDO, Takahiko KIKU, Francesco CHILOSI, Silvio RESTEGHINI
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Title:
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MODULAR MULTILEVEL CONVERTER AND MODULAR MULTILEVEL CONVERTER SYSTEM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 29-14, SHIBA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 108-0014 |
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| 1-19-43, HIGASHI-OIZUMI, NERIMA-KU |
| TOKYO, JAPAN 178-8511 |
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| MCDERMOTT WILL & EMERY LLP |
| 500 NORTH CAPITOL STREET, NW |
| WASHINGTON, DC 20001 |
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07/14/2025 02:27 AM
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