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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
05/27/2025
Application #:
18624411
Filing Dt:
04/02/2024
Publication #:
Pub Dt:
07/25/2024
Inventors:
Nam Hoon Kim, Woon-Seong Kwon, Teckgyu Kang, Yujeong Shim
Title:
Integrated Circuit Package For High Bandwidth Memory
Assignment: 1
Reel/Frame:
066989/0099Recorded: 04/03/2024Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/25/2021
Exec Dt:
01/22/2021
Exec Dt:
01/24/2021
Exec Dt:
01/22/2021
Assignee:
1600 AMPHITHEATRE PARKWAY
MOUNTAIN VIEW, CALIFORNIA 94043
Correspondent:
LERNER DAVID LLP
20 COMMERCE DR.
CRANFORD, NJ 07016
Assignment: 2
Reel/Frame:
069120/0527Recorded: 11/04/2024Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/17/2024
Assignee:
2 GATEWAY CENTER
15TH FLOOR
NEWARK, NEW JERSEY 07102
Correspondent:
LENNIE A. BERSH
GREENBERG TRAURIG, LLP
500 CAMPUS DRIVE, SUITE 400
FLORHAM PARK, NJ 07932

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