Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
02/11/2025
|
Application #:
|
18560992
|
Filing Dt:
|
11/15/2023
|
|
Publication #:
|
|
Pub Dt:
|
08/08/2024
| | | | |
|
Inventors:
|
Tomohiro YAMAGAME, Shuta AKATSUKA, Sakie OKADA, Keisuke SHINOZAKI, Kenta INOUE
|
|
Title:
|
FLUX AND SOLDER PASTE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 23, SENJU-HASHIDO-CHO |
| ADACHI-KU, TOKYO, JAPAN 120-8555 |
|
|
|
|
| NIXON PEABODY LLP |
| 799 9TH STREET NW |
| SUITE 500 |
| WASHINGTON, DC 20001 |
|
|
Search Results as of:
07/10/2025 01:20 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
