Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18202574
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Filing Dt:
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05/26/2023
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Publication #:
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Pub Dt:
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08/08/2024
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Inventors:
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Kyeong Hoon Jang, Seul Yi, Eun Seob Shin, Kang Il Jeon
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Title:
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POLYAMIDE COMPOSITE RESIN COMPOSITION HAVING HIGH RIGIDITY AND LOW WATER ABSORPTION AND MOLDED ARTICLE COMPRISING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12, HEOLLEUNG-RO, SEOCHO-GU |
| SEOUL, KOREA, REPUBLIC OF 06797 |
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| 12, HEOLLEUNG-RO, SEOCHO-GU |
| SEOUL, KOREA, REPUBLIC OF 06797 |
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| 1221-32, DAEHOMAN-RO, SEONGMUN-MYEON, CHUNGCHEONGNAM-DO |
| DANGJIN-SI, KOREA, REPUBLIC OF 31703 |
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| MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP |
| 300 SOUTH WACKER DRIVE |
| CHICAGO, IL 60606 |
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