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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
06/24/2025
Application #:
18398984
Filing Dt:
12/28/2023
Publication #:
Pub Dt:
08/08/2024
Inventors:
Belgacem HABA, Gaius Gillman FOUNTAIN JR., Thomas WORKMAN, Kyong-Mo BANG, Ron ZHANG
Title:
ELECTRONIC DEVICE COOLING STRUCTURES BONDED TO SEMICONDUCTOR ELEMENTS
Assignment: 1
Reel/Frame:
066169/0102Recorded: 01/18/2024Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/28/2023
Exec Dt:
12/28/2023
Exec Dt:
01/03/2024
Exec Dt:
01/08/2024
Exec Dt:
01/02/2024
Assignee:
3025 ORCHARD PARKWAY
SAN JOSE, CALIFORNIA 95134
Correspondent:
KNOBBE, MARTENS, OLSON & BEAR LLP
2040 MAIN STREET
14TH FLOOR
IRVINE, CA 92614

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