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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
18438638
Filing Dt:
02/12/2024
Publication #:
Pub Dt:
08/08/2024
Inventors:
Michael Kelly, Ronald Patrick Huemoeller, David Jon Hiner
Title:
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
Assignment: 1
Reel/Frame:
066572/0837Recorded: 02/13/2024Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/13/2015
Exec Dt:
04/07/2015
Exec Dt:
04/13/2015
Assignee:
2045 E. INNOVATION CIRCLE
TEMPE, ARIZONA 85284
Correspondent:
JEFFREY B. HUTER
MCANDREWS, HELD & MALLOY, LTD.
500 WEST MADISON STREET-SUITE 3400
CHICAGO, IL 60061
Assignment: 2
Reel/Frame:
066573/0633Recorded: 02/13/2024Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/19/2019
Assignee:
491 B RIVER VALLEY ROAD
VALLEY POINT #12/03
SINGAPORE, SINGAPORE 248373
Correspondent:
JEFFREY B. HUTER
MCANDREWS, HELD & MALLOY, LTD.
500 WEST MADISON STREET-SUITE 3400
CHICAGO, IL 606661

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