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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	NONE	Issue Dt:		Application #:	18124674	Filing Dt:	03/22/2023
Publication #:	20240266414	Pub Dt:	08/08/2024
Inventors:	Srinivas Gandikota, Yixiong Yang, Tengzhou Ma, Tianyi Huang, Geetika Bajaj, Hsin-Jung Yu et al
Title:	MULTI-VT INTEGRATION SCHEME FOR SEMICONDUCTOR DEVICES

Assignment: 1

Reel/Frame:

Recorded: 09/22/2023

Pages: 5

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

GANDIKOTA, SRINIVAS

Exec Dt:

04/10/2023

Exec Dt:

04/10/2023

Exec Dt:

04/10/2023

Exec Dt:

09/22/2023

Exec Dt:

04/10/2023

Exec Dt:

05/08/2023

GANGULI, SESHADRI

Exec Dt:

04/23/2023

Assignee:

APPLIED MATERIALS, INC.

3050 BOWERS AVENUE

SANTA CLARA, CALIFORNIA 95054

Correspondent:

SERVILLA WHITNEY LLC

33 WOOD AVE SOUTH SUITE 830

ISELIN, NJ 08830

Search Results as of: 08/10/2025 06:52 PM

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