Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18415006
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Filing Dt:
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01/17/2024
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Publication #:
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Pub Dt:
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08/15/2024
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Inventor:
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Jefferson Sismundo TALLEDO
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Title:
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POWER LEADFRAME PACKAGE WITH LEAD SIDEWALL SURFACE THAT IS FULLY SOLDER WETTABLE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CHEMIN DU CHAMP-DES-FILLES |
| PLAN-LES-OUATES |
| GENEVA, SWITZERLAND 1228 |
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| RAJ K. KRISHNAN |
| STMICROELECTRONICS, INC. |
| 750 CANYON DRIVE, SUITE 300 |
| COPPELL, TX 75019 |
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08/08/2025 01:29 PM
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