Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18654125
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Filing Dt:
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05/03/2024
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Publication #:
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Pub Dt:
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08/22/2024
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Inventors:
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Soon Lee Liew, Eng Wah Woo, Alexander Komposch
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Title:
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METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES AND LEADFRAMES FOR SEMICONDUCTOR DEVICE PACKAGES
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 4600 SILICON DRIVE |
| DURHAM, NORTH CAROLINA 27703 |
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| SAGE PATENT GROUP |
| PO BOX 30789 |
| RALEIGH, NC 27622 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4600 SILICON DRIVE |
| DURHAM, NORTH CAROLINA 27703 |
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| SAGE PATENT GROUP |
| PO BOX 30789 |
| RALEIGH, NC 27622 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 100 CHELMSFORD STREET |
| LOWELL, MASSACHUSETTS 01851 |
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| SAGE PATENT GROUP |
| PO BOX 30789 |
| RALEIGH, NC 27622 |
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09/22/2024 06:29 AM
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