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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18239126
Filing Dt:
08/29/2023
Publication #:
Pub Dt:
09/05/2024
Inventor:
Yun Hwa CHOI
Title:
SEMICONDUCTOR PACKAGE HAVING HEAT EMITTING POST BONDED THERETO AND METHOD OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
064728/0747Recorded: 08/29/2023Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/29/2023
Assignee:
29, UIGWAHAK 5-RO, JANG-AN-EUP, GIJANG-GUN
BUSAN, KOREA, REPUBLIC OF 46034
Correspondent:
PARK, KIM & SUH, LLC
2121 AVENUE OF THE STARS, SUITE 800
CENTURY CITY, CA 90067

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