Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18591705
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Filing Dt:
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02/29/2024
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Publication #:
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Pub Dt:
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09/05/2024
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Inventors:
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Jaber Derakhshandeh, Vadiraj Manjunath Ananthapadmanabha Rao, Danny Wan, Eric Beyne et al
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Title:
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METHOD FOR PRODUCING SOLDER BUMPS ON A SUPERCONDUCTING QUBIT SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| KAPELDREEF 75 |
| LEUVEN, BELGIUM 3001 |
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| JANE LAGIGLIO |
| MCDONNELL, BOEHNEN, HULBERT & BERGHOFF LLP |
| 300 SOUTH WACKER DRIVE, SUITE 3100 |
| CHICAGO, IL 60606 |
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09/24/2024 02:32 AM
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