Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18670309
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Filing Dt:
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05/21/2024
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Publication #:
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Pub Dt:
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09/12/2024
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Inventors:
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Ramji Sitaraman Lakshmanan et al., Bernard Stenson, Oliver Kierse et al
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Title:
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INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BAY F1 RAHEEN INDUSTRIAL ESTATE |
| LIMERICK, CO. LIMERICK, IRELAND V944V2 |
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| SCHWEGMAN LUNDBERG & EPHRAIM DAVID WOESSNER, P.A. |
| P.O. BOX 2938 |
| MINNEAPOLIS, MN 55402 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BAY F1 RAHEEN INDUSTRIAL ESTATE |
| LIMERICK, CO. LIMERICK, IRELAND V944V2 |
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| SCHWEGMAN LUNDBERG & D. WOESSNER, P.A. |
| P.O. BOX 2938 |
| MINNEAPOLIS, MN 55402 |
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09/24/2024 05:17 AM
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