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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18345303
Filing Dt:
06/30/2023
Publication #:
20240355740
Pub Dt:
10/24/2024
Inventors:
Feng-Yu Chang, Sheng-Hsuan Lin, Shu-Lan Chang, Kai-Yi Chu, Meng-Hsien Lin, Pei-Hsuan Lee et al
Title:
Barrier Free Tungsten Liner in Contact Plugs and The Method Forming the Same
Assignment: 1
Reel/Frame:
064286/0666Recorded: 07/17/2023Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHANG, FENG-YU
Exec Dt:
06/19/2023
LIN, SHENG-HSUAN
Exec Dt:
06/20/2023
CHANG, SHU-LAN
Exec Dt:
06/22/2023
CHU, KAI-YI
Exec Dt:
06/28/2023
LIN, MENG-HSIEN
Exec Dt:
06/28/2023
LEE, PEI-HSUAN
Exec Dt:
06/28/2023
CHANG, PEI SHAN
Exec Dt:
06/26/2023
CHI, CHIH-CHIEN
Exec Dt:
06/20/2023
TSAI, CHUN-I
Exec Dt:
07/16/2023
LIN, WEI-JUNG
Exec Dt:
06/27/2023
CHANG, CHIH-WEI
Exec Dt:
06/26/2023
TSAI, MING-HSING
Exec Dt:
06/26/2023
JANG, SYUN-MING
Exec Dt:
06/20/2023
LO, WEI-JEN
Exec Dt:
06/28/2023
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
SLATER MATSIL, LLP
17950 PRESTON RD., SUITE 1000
DALLAS, TX 75252

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