Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18802455
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Filing Dt:
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08/13/2024
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Publication #:
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Pub Dt:
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12/05/2024
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Inventors:
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Lei ZHANG, Zunmiao CHEN, Lin SHI, Bo LIU, Jing WANG, Guicheng FAN
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Title:
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SYSTEM-IN PACKAGE COMPONENT, ELECTRONIC DEVICE, AND SYSTEM-IN PACKAGE COMPONENT MANUFACTURING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HUAWEI ADMINISTRATION BUILDING, BANTIAN |
| LONGGANG DISTRICT |
| SHENZHEN, GUANGDONG, CHINA 518129 |
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| WOMBLE BOND DICKINSON |
| P.O. BOX 570489 |
| ATLANTA, GA 30357-0037 |
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