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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18676810
Filing Dt:
05/29/2024
Publication #:
Pub Dt:
12/12/2024
Inventor:
Kazuya HIRATA
Title:
WAFER MANUFACTURING METHOD AND PROCESSING APPARATUS
Assignment: 1
Reel/Frame:
067548/0611Recorded: 05/29/2024Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/14/2024
Assignee:
13-11, OMORI-KITA 2-CHOME, OTA-KU
TOKYO, JAPAN 143-8580
Correspondent:
KATRINA MCKENZIE
GREER BURNS & CRAIN LTD.
300 S. WACKER DRIVE, SUITE 2500
CHICAGO, IL 60606

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