Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18333380
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Filing Dt:
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06/12/2023
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Publication #:
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Pub Dt:
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12/12/2024
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Inventors:
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Cheng-Chin LEE, Hsin-Yen HUANG, Hsiao-Kang CHANG, Yen-Ju WU, Shao-Kuan LEE, Li-Ling SU et al
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Title:
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INTERCONNECT STRUCTURE HAVING HEAT DISSIPATION CAPABILITY AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| BIRCH STEWART KOLASCH & BIRCH LLP |
| 8110 GATEHOUSE ROAD, SUITE 100E |
| FALLS CHURCH, VA 22042 |
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06/22/2025 05:37 PM
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