Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18733292
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Filing Dt:
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06/04/2024
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Publication #:
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Pub Dt:
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12/12/2024
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Inventors:
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Shiou-Yi KUO, Chin-Hung LUNG, Bo-Yu CHEN
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Title:
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WAFER WITH MICRO INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6F, NO 21, LIXING RD |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300094 |
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| PATTERSON + SHERIDAN LLP |
| 24 GREENWAY PLAZA |
| SUITE 1600 |
| HOUSTON, TX 77046 |
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