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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
18334527
Filing Dt:
06/14/2023
Publication #:
20240421053
Pub Dt:
12/19/2024
Inventors:
Qianli MU, Heather BARTON, Basim NOORI, Dan NAMISHIA, Dan ETTER, Alexander KOMPOSCH
Title:
PACKAGED DEVICE HAVING AN INTEGRATED PASSIVE DEVICE WITH WAFER LEVEL FORMED CONNECTION TO AT LEAST ONE SEMICONDUCTOR DEVICE AND PROCESSES FOR IMPLEMENTING THE SAME
Assignment: 1
Reel/Frame:
063964/0419Recorded: 06/15/2023Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
MU, QIANLI
Exec Dt:
06/13/2020
BARTON, HEATHER
Exec Dt:
06/13/2023
NOORI, BASIM
Exec Dt:
06/13/2023
NAMISHIA, DAN
Exec Dt:
06/14/2023
ETTER, DAN
Exec Dt:
06/13/2023
KOMPOSCH, ALEXANDER
Exec Dt:
06/13/2023
Assignee:
WOLFSPEED, INC.
4600 SILICON DRIVE
DURHAM, NORTH CAROLINA 27703
Correspondent:
BAKERHOSTETLER
1050 CONNECTICUT AVENUE, NW
SUITE 1100
WASHINGTON, DC 20036
Assignment: 2
Reel/Frame:
066236/0086Recorded: 12/29/2023Pages: 65
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
WOLFSPEED, INC.
Exec Dt:
12/06/2023
Assignee:
MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
100 CHELMSFORD STREET
LOWELL, MASSACHUSETTS 01851
Correspondent:
ROB WINDER
4000 MACARTHUR BLVD
NEWPORT BEACH, CA 92660

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