Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18753144
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Filing Dt:
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06/25/2024
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Publication #:
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Pub Dt:
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01/02/2025
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Inventors:
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Liqi Wu, Rongjun Wang, Feng Q. Liu, Qihao Zhu, Jiang Lu, David Thompson, Xianmin Tang
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Title:
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BOTTOM-UP GAP FILL PROCESSES FOR SEMICONDUCTOR SUBSTRATES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| SERVILLA WHITNEY LLC |
| 33 WOOD AVENUE SOUTH |
| SUITE 830 |
| ISELIN, NJ 08830 |
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06/22/2025 02:22 PM
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