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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18260656
Filing Dt:
07/07/2023
Publication #:
20250006873
Pub Dt:
01/02/2025
Inventors:
Wei LI, Mingxing WANG, Xiao ZHANG, Minghua XUAN, Can ZHANG, Can WANG, Dongliang ZHANG et al
Title:
CHIP STRUCTURE AND MANUFACTURING METHOD THEREFOR, DISPLAY SUBSTRATE AND DISPLAY DEVICE
Assignment: 1
Reel/Frame:
064227/0954Recorded: 07/07/2023Pages: 24
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LI, WEI
Exec Dt:
03/14/2023
WANG, MINGXING
Exec Dt:
03/14/2023
ZHANG, XIAO
Exec Dt:
03/14/2023
XUAN, MINGHUA
Exec Dt:
03/14/2023
ZHANG, CAN
Exec Dt:
03/14/2023
WANG, CAN
Exec Dt:
03/14/2023
ZHANG, DONGLIANG
Exec Dt:
03/14/2023
JIN, QIAN
Exec Dt:
03/14/2023
LI, XIANG
Exec Dt:
03/14/2023
ZHANG, JINGJING
Exec Dt:
03/14/2023
NIU, JINFEI
Exec Dt:
03/14/2023
Assignee:
BOE TECHNOLOGY GROUP CO., LTD.
NO.10 JIUXIANQIAO RD., CHAOYANG DISTRICT
BEIJING, CHINA 100015
Correspondent:
DORITY & MANNING, PA
POST OFFICE BOX 1449
GREENVILLE, SC 29602

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