Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18548076
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Filing Dt:
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08/26/2023
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Publication #:
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Pub Dt:
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01/09/2025
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Inventors:
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Yilin XU, Rui WU, Zhijun WU, Zhengmin CAO, Ruipeng LI, Dawei WANG, Yao WAN
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Title:
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WORKTABLE FOR CUTTING MONOCRYSTALLINE SILICON WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 12, EAST HAITAI ROAD, HUAYUAN INDUSTRIAL PARK, (OUTER RING), TIANJIN NEW TECHNOLOGY INDUSTRIAL PARK, BINHAI NEW AREA |
| TIANJIN, CHINA 300384 |
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| WEI TE CHUNG |
| 1079 LANCER DRIVE |
| SAN JOSE, CA 95129 |
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