Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18885892
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Filing Dt:
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09/16/2024
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Publication #:
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Pub Dt:
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01/23/2025
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Inventors:
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Katsumi MIZUNO, Kohei SHIMOMURA, Saki SUDO
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Title:
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EPOXY RESIN COMPOSITION FOR INTERLAYER INSULATION, RESIN SHEET FOR INTERLAYER INSULATION, LAMINATE FOR CIRCUIT BOARD, METAL- BASED CIRCUIT BOARD, AND POWER MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-10, FUKUURA, KANAZAWA-KU |
| YOKOHAMA-SHI, KANAGAWA, JAPAN 236-0004 |
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| HOLTZ, HOLTZ & VOLEK PC |
| 630 NINTH AVE |
| SUITE 1010 |
| NEW YORK, NY 10036 |
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07/16/2025 05:19 PM
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