Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18749647
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Filing Dt:
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06/21/2024
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Publication #:
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Pub Dt:
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01/30/2025
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Inventors:
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HyeonChul LEE, KyoungHee PARK, KyungHwan KIM, SeungHyun LEE
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Title:
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MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 299 JAYUMUYEOK-RO JUNG-GU |
| INCHEON, KOREA, REPUBLIC OF 22379 |
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| MR. JAMES J. ZHU |
| 20380 TOWN CENTER LANE, SUITE 128 |
| CUPERTINO, CA 95014 |
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