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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18615675
Filing Dt:
03/25/2024
Publication #:
Pub Dt:
01/30/2025
Inventors:
Minjin Kim, Seongho Shin
Title:
SEMICONDUCTOR PACKAGE
Assignment: 1
Reel/Frame:
066955/0425Recorded: 03/29/2024Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/06/2024
Exec Dt:
02/06/2024
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondent:
AMY PIRKL
60 SOUTH SIXTH STREET
SUITE #3200
MINNEAPOLIS, MN 55402

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