Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18614346
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Filing Dt:
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03/22/2024
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Publication #:
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Pub Dt:
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02/20/2025
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Inventors:
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Tianquan SHI, Zhenghong LIU, Ruisheng QI, Guanqun HUANG, Haoyu CHEN
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Title:
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METHOD FOR MANUFACTURING ALUMINUM PAD OF SEMICONDUCTOR CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6 LIANGTENG ROAD |
| PUDONG NEW AREA |
| SHANGHAI, CHINA 201314 |
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| QUARLES & BRADY LLP |
| 411 EAST WISCONSIN AVENUE |
| SUITE 2400 |
| MILWAULKEE, WI 53202 |
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06/22/2025 02:14 PM
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