Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18255811
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Filing Dt:
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06/02/2023
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Publication #:
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Pub Dt:
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03/27/2025
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Inventors:
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Jack Zezhong PENG, Ke WANG
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Title:
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HIGH-DENSITY THREE-DIMENSIONAL MEMORY DEVICE WITH INTERCONNECTION OF LOW RESISTANCE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LINKMAN: JACK ZEZHONG PENG, ROOM 3, FLOOR 11, UNIT 1, BUILDING 5 |
| NO. 399, WEST OF FUCHENG ROAD, HI-TECH DISTRICT, SICHUAN |
| CHENGDU, CHINA 610041 |
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| STANEK LEMON CROUSE & MEEKS |
| 982 TRINITY ROAD |
| RALEIGH, NC 27607 |
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Search Results as of:
06/25/2025 05:32 AM
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