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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18981677
Filing Dt:
12/16/2024
Publication #:
Pub Dt:
04/10/2025
Inventors:
Jeffrey Punzalan, IL KWON SHIM
Title:
MULTI-CHIP IMAGE SENSOR SEMICONDUCTOR PACKAGE
Assignment: 1
Reel/Frame:
069589/0678Recorded: 12/16/2024Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/09/2024
Exec Dt:
10/28/2024
Assignee:
22 ANG MI KIO INDUSTRIAL PARK 2
SINGAPORE, SINGAPORE 569506
Correspondent:
MR. DEXTER CHIN
7500A BEACH ROAD
#15-322 THE PLAZA
SINGAPORE, 199591 SINGAPORE

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