Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18728572
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Filing Dt:
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07/15/2024
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Publication #:
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Pub Dt:
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04/17/2025
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Inventors:
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Ue Ryung Seo, Ji Seok Lee, Soonhee Kang, Hyungsam Choi
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Title:
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Compound and Molded Body Comprising Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 128, YEOUI-DAERO, YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 07336 |
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| LERNER DAVID LLP |
| 20 COMMERCE DR. |
| CRANFORD, NJ 07016 |
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08/11/2025 11:17 PM
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