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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18883053
Filing Dt:
09/12/2024
Publication #:
Pub Dt:
05/15/2025
Inventors:
Jongkook KIM, Heungkyu KWON, Youngchul KIM, Choonheung LEE, Donghyun CHA, Junghwa KIM et al
Title:
SEMICONDUCTOR PACKAGE
Assignment: 1
Reel/Frame:
068607/0559Recorded: 09/17/2024Pages: 20
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/18/2024
Exec Dt:
08/29/2024
Exec Dt:
06/03/2024
Exec Dt:
06/03/2024
Exec Dt:
05/29/2024
Exec Dt:
04/18/2024
Exec Dt:
04/19/2024
Exec Dt:
05/31/2024
Exec Dt:
04/18/2024
Exec Dt:
06/05/2024
Exec Dt:
04/19/2024
Exec Dt:
04/18/2024
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
JOSEPH ANNIBELL
P.O. BOX 8910
RESTON, VA 20195

Search Results as of: 10/02/2025 01:06 PM
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