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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
19035040
Filing Dt:
01/23/2025
Publication #:
Pub Dt:
05/22/2025
Inventors:
Jae Jun LEE, Sung Kyu KIM, Jong Yeon KIM, Ki Ill MOON, Ju Heon YANG, BEOLI OK
Title:
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
Assignment: 1
Reel/Frame:
069979/0634Recorded: 01/23/2025Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/17/2025
Exec Dt:
01/17/2025
Exec Dt:
01/17/2025
Exec Dt:
01/17/2025
Exec Dt:
01/17/2025
Exec Dt:
01/17/2025
Assignee:
2091, GYEONGCHUNG-DAERO, BUBAL-EUB
ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF 17336
Correspondent:
WILLIAM PARK & ASSOCIATES WILLIAM LTD.
930 N. YORK ROAD SUITE 201
HINSDALE, IL 60521

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