Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/17/2025
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Application #:
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18880717
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Filing Dt:
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01/02/2025
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Publication #:
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Pub Dt:
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05/29/2025
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Inventors:
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Keisuke SHINOZAKI, Kazuya KITAZAWA, Hiroaki KAWAMATA, Yuki FUJINO
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Title:
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FLUX, SOLDER PASTE, AND METHOD FOR PRODUCING BONDED BODY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23, SENJU-HASHIDO-CHO |
| ADACHI-KU, TOKYO, JAPAN 120-8555 |
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| JEFFREY L. COSTELLIA |
| 799 9TH STREET NW |
| SUITE 500 |
| WASHINGTON, DC 20001 |
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07/10/2025 06:11 AM
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