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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
19038680
Filing Dt:
01/27/2025
Publication #:
Pub Dt:
05/29/2025
Inventors:
Owen R. Fay, Chan H. Yoo, Mark E. Tuttle
Title:
THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
070022/0478Recorded: 01/27/2025Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/12/2019
Exec Dt:
06/12/2019
Exec Dt:
06/12/2019
Assignee:
8000 S. FEDERAL WAY
P.O. BOX 6
BOISE, IDAHO 83707-0006
Correspondent:
JOSHUA M. NELSON
PO BOX 1247
SEATTLE, WA 98111-1247

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