Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18848538
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Filing Dt:
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09/19/2024
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Publication #:
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Pub Dt:
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06/19/2025
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Inventors:
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Shintaro Iida, Keiko Ashida
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Title:
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THERMALLY CONDUCTIVE POLYMER COMPOSITION, MATERIAL FOR FORMING THERMALLY CONDUCTIVE POLYMER COMPOSITION, THERMALLY CONDUCTIVE POLYMER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8117 |
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| JAMES E. ARMSTRONG IV |
| LOCKE LORD LLP |
| 701 8TH ST NW, SUITE 500 |
| WASHINGTON, DC 20001-4360 |
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