Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18636512
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Filing Dt:
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04/16/2024
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Publication #:
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Pub Dt:
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06/19/2025
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Inventors:
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Wen Hua Zhang, I CHEN HSU, Cheng Ying Wu, Kuo-hua Peng, CHIEN-JUNG CHIU
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Title:
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SERVER AND HEAT DISSIPATION MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 21F., NO.88, SEC. 1, HSINTAI 5TH RD., HSICHIH |
| NEW TAIPEI CITY, TAIWAN 22181 |
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| MCCLURE QUALEY & RODACK LLP |
| 280 INTERSTATE NORTH CIRCLE |
| SUITE 530 |
| ATLANTA, GA 30339 |
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08/15/2025 02:03 AM
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