Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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19080991
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Filing Dt:
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03/17/2025
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Publication #:
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Pub Dt:
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06/26/2025
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Inventors:
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Jen-Yuan CHANG, Chien-Chang LEE, Shih-Chang CHEN, Chia-Ping LAI, Tzu-Chung TSAI
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Title:
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SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE AND METHODS FOR FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN ROC 30077 |
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| MRS. WHITNEY MCNEIL |
| THE MARBURY LAW GROUP |
| 11800 SUNRISE VALLEY DRIVE, 15TH FLOOR |
| RESTON, VA 20191 |
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08/25/2025 09:24 AM
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